DY20 Semiconductor Radiator – Mobile Phone Clip Cooler
Key Features & Specs
Model: DY20 semiconductor radiator back‐clip mobile cooler
Compatibility: Fits mobile phones 4′′ to ~6.5′′ wide (~2.6–3.5 inches) across various brands and models
Weight: Lightweight ~150 g
Cooling Technology: Combines
semiconductor (TEC) refrigeration chip for fast heat absorption, and
air cooling fan for active heat dissipation
Operation: One-button (one-key) quick start cooling mode; portable back-clip design